Peer Review History: Addressing Package Voids on Extremely Small Leadframe Device

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Specific Comment:

Peer Review History:

Average Peer review marks at initial stage: 8.75/10

Average Peer review marks at publication stage: 9.5/10


Stage 1Original Manuscript | File 1 | NA


Stage 2Peer review report_1 (Barsana Banu J, India) | File 1 | NA


Stage 2Peer review report_2 (Atishey Mittal, India) | File 1 | NA


Stage 2Revised_MS_v1_and_Feedback_v1 | File 1 | File 2


Stage 3Comment_Editor_1_v1 | File 1 | NA