Peer Review History: Wirebond Solution of Semiconductor IC Package through Modeling and Simulation

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Specific Comment:

Average Peer review marks at initial stage: 9/10

Average Peer review marks at publication stage: 9.7/10

Peer Review History:

Stage 1 | Original Manuscript | File 1 | NA

Stage 2 | Peer review report_1 (Yuan-Tsung Chen, Taiwan) | File 1 | NA

Stage 2 | Peer review report_2 (Adel H. Phillips, Egypt) | File 1 | NA

Stage 2 | Peer review report_3 (Himanshu Dehra, India) | File 1 | NA

Stage 2 | Peer review report_4 (Boyan Karapenev, Bulgaria) | File 1 | NA

Stage 2 | Revised_MS_v1_and_Feedback_v1 | File 1 | File 2

Stage 3 | Comment_Editor_1_v1 | File 1 | NA