Peer Review History: Package Substrate Die Pad Roughening Innovative Solution to Strengthened Die Attach Adhesion

Open Peer Review Policy: Click Here

Specific Comment:

Peer Review History:

Average Peer review marks at initial stage: 7/10

Average Peer review marks at publication stage: 8.75/10

Stage 1 | Original Manuscript | File 1 | NA

Stage 2 | Peer review report_1 (Ayyob Aadbeigi, Iran) | File 1 | File 2

Stage 2 | Peer review report_2 (Sugondo Hadiyoso, Indonesia) | File 1 | NA

Stage 2 | Revised_MS_v1_and_Feedback_v1 | File 1 | File 2

Stage 3 | Comment_Editor_1_v1 | File 1 | NA

Stage 3 | Revised_MS_v2_and_Feedback_v2 | File 1 | NA

Stage 3 | Comment_Editor_2_v2 | File 1 | NA