Peer Review History: Package Substrate Die Pad Roughening Innovative Solution to Strengthened Die Attach Adhesion

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Specific Comment:

Peer Review History:

Average Peer review marks at initial stage: 7/10

Average Peer review marks at publication stage: 8.75/10


Stage 1Original Manuscript | File 1 | NA


Stage 2Peer review report_1 (Ayyob Aadbeigi, Iran) | File 1 | File 2


Stage 2Peer review report_2 (Sugondo Hadiyoso, Indonesia) | File 1 | NA


Stage 2Revised_MS_v1_and_Feedback_v1 | File 1 | File 2


Stage 3Comment_Editor_1_v1 | File 1 | NA


Stage 3Revised_MS_v2_and_Feedback_v2 | File 1 | NA


Stage 3Comment_Editor_2_v2 | File 1 | NA