Peer Review History: Modeling Study on the Impact of Mold Thickness on Strip Warpage of a Molded Leadframe Package

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Specific Comment:

Average Peer review marks at initial stage: 6.9/10

Average Peer review marks at publication stage: 7.5/10

Peer Review History:


Stage 1 | Original Manuscript | File 1 | NA


Stage 2 | Peer review report_1 (Mulugeta Tadesse,  Ethiopia) | File 1 | NA


Stage 2 | Peer review report_2 (Pan Zhongjian Sunward,China) | File 1 | NA


Stage 2 | Peer review report_3 (Mohamed Omar Sulyman,  Poland) | File 1 | NA


Stage 2 | Revised_MS_v1_and_Feedback_v1 | File 1 | File 2


Stage 3 | Comment_Editor_1_v1 | File 1 | NA