Peer Review History: Assembly Wirebond Process Solution for Mitigating Leadframe Bouncing on Multi-Die QFN Device

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Specific Comment:

Average Peer review marks at initial stage: 8.66/10

Average Peer review marks at publication stage: 9/10

Peer Review History:


Stage 1 | Original Manuscript | File 1 | NA


Stage 2 | Peer review report_1 (Yeison Alberto Garcés Gómez, Colombia) | File 1 | NA


Stage 2 | Peer review report_2 (D. Karthikeyan, India) | File 1 | NA


Stage 2 | Peer review report_3 (I Made Ginarsa, Indonesia) | File 1 | NA


Stage 2 | Revised_MS_v1_and_Feedback_v1 | File 1 | File 2


Stage 3 | Comment_Editor_1_v1 | File 1 | NA